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IJFESTOpen access · Peer reviewed International Journal of Future Engineering and Sustainable Technologies ReoTek International Journals · Double-blind peer review · CC BY 4.0

Editorial board

Led by the Editor-in-Chief, with three associate editors and two section editors covering the journal’s subject areas. Editors serve renewable two-year terms and disclose all conflicts of interest under our conflict of interest policy.

Editor-in-Chief

Mr. Saswat Swain, Editor-in-Chief

Editor-in-Chief

Mr. Saswat Swain

KIIT University, India · ReoTek International Journals

Sets the editorial direction of the journal, chairs the editorial board and holds final decision authority on every manuscript. A public sector specialist with more than a decade advising government agencies on strategic digital initiatives, policy frameworks, portfolio management, business strategy and cyber security.

editorial@ijfest.com +91 77880 08009 India +971 56 355 0386 UAE

Associate editors

Dr. Chandrasekhar Panda, Associate Editor

Associate Editor · Digital Strategy & Technology Modernization

Dr. Chandrasekhar Panda

Copenhagen Business School, Denmark

Leads the Digital Strategy & Technology Modernization section, overseeing reviewer assignment for submissions on digital transformation, large-scale technology modernization, M&A and technology due diligence, IT value assurance and AI-enabled operating models.

contact@chandrasekharpanda.com

Dr. Henning Soller, Associate Editor

Associate Editor · Future Technologies & Quantum Computing

Dr. Henning Soller

University of Heidelberg, Germany

Leads the Future Technologies & Quantum Computing section, overseeing reviewer assignment for submissions on quantum computing, quantum communication, quantum sensing and related frontier technologies.

Contact via editorial office

Margarita Mlodziejewska, Associate Editor

Associate Editor · Cloud & Next-Generation Infrastructure

Margarita Mlodziejewska

SGH Warsaw School of Economics, Poland

Leads the Cloud & Next-Generation Infrastructure section, overseeing reviewer assignment for submissions on cloud computing, hybrid and multi-cloud architectures, edge computing, cloud-native platforms, AI-ready infrastructure and next-generation data centres.

Contact via editorial office

Editors

Pravat Satpathy, Editor

Editor · Emerging Technologies, IoT & Intelligent Communication Systems

Pravat Satpathy

R & D Division, Tekstein Solutions, India

Leads the Emerging Technologies & Intelligent Systems section, overseeing reviewer assignment for submissions in LiFi and optical wireless communication, IoT and IIoT, embedded and sensor systems, AI-enabled IoT, intelligent communication networks, disaster-resilient technologies, smart infrastructure and sustainable technology applications.

pravat@teksteinsolutions.com

Sonia Mohapatra, Editor

Editor · IoT, Embedded Systems & Emerging Technologies

Sonia Mohapatra

R & D Division, Tekstein Solutions, India

Leads the IoT, Embedded Systems & Emerging Technologies section, overseeing reviewer assignment for submissions on IoT-enabled systems, embedded hardware, intelligent sensing, smart agriculture, renewable energy systems, environmental monitoring, disaster-alert technologies, mining safety and sustainable engineering innovations.

sonia@teksteinsolutions.com

Reviewer board

We have not yet recruited a reviewer pool. We are looking for researchers and practitioners with a real publication or professional record in ESG measurement, industrial IoT or applied AI — including industry reviewers who have run these systems rather than only written about them.

Reviewers receive a named certificate on completion and are credited, with consent, in the annual acknowledgement list.

Apply to join the reviewer board

How editors are appointed

Expression of interest

CV and a short statement of subject expertise.

Record check

Publication history and standing in the field verified.

Conflict disclosure

Commercial and institutional interests declared in writing.

Appointment

Two-year renewable term; name and affiliation published here.